Cerium oxide rare earth polishing powder
Cerium oxide rare earth polishing powder is a general term for polishing powder containing cerium oxide rare earth components. It is a refined rare earth powder made from cerium rich rare earth ores through chemical synthesis and extraction. Then it is treated by pretreatment, high-temperature calcination, sieving, filtration and drying. The polishing function of rare earth polishing powder is a combination of mechanical physical polishing and chemical polishing. It has the advantages of high polishing efficiency, good smoothness, long service life, and no environmental pollution. It is suitable for polishing products such as glass, optical crystal components, glass shell LED screens, silicon wafers, automotive glass, semiconductor crystals, crystal handicrafts, etc.
Basic information:
CAS No. & Formula | Cerium Oxide(CeO2):1306-38-3, Lanthanum oxide(La2O3):1312-81-8 Praseodymium oxide(Pr6O11): 12037-29-5 |
Appearance | White, Light Yellow or red brown Color Powder |
ENS NO. | 215-150-4 215-200-5 234-857-9 |
True Density | 6.5-7.2g/cm3 |
Melting Point | 2600 Centigrade |
water-solubility | Insoluble |
Color of cerium oxide rare earth polishing powder:
- Pure cerium oxide’s color varies depending on the calcination temperature, and the higher the calcination temperature, the lighter the color.
- The color of cerium oxide powder containing lanthanum oxide is milky white.
- Color of cerium oxide powder containing praseodymium oxide is orange or brownish red.
Chemical composition:
Type | Chemical content |
Cerium oxide polishing powder | TREO ≥99%, CeO2/REO≥99%; CeO2/REO≥99.95%;CeO2/REO≥99.99% |
Lanthanum cerium polishing powder | TREO ≥99%, CeO2/REO:62-68%,La2O3/REO:32-38% |
Praseodymium cerium polishing powder | TREO ≥94%, CeO2/REO:63-67%,Pr6O11/REO:0.9-1.1% |
Lanthanum cerium praseodymium polishing powder | TREO ≥99%, CeO2/REO:60-70%, La2O3/REO:30-40%, Pr6O11/REO:0-6% |
Applications:
- Polishing optical glass, optical crystals, high-precision optical lenses, camera lenses, and other components.
- Polishing integrated circuit substrate glass and electroplated substrate glass.
- Slicing and polishing electronic touch photoelectric panels.
- Polishing materials such as tempered glass for airplanes, car windshields, and flat glass.
- Lapping semiconductor silicon wafers.
- Polishing gemstones, crystals, rhinestones, microcrystalline glass and other materials.
Packaging:
- 25kg cardboard box+1t pallet
- 25kg plastic drum+675kg/pallet
- 25 kg woven bag+1 ton bag